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| IP4350CX24 9-channel SD memory card interface ESD protection filter to IEC 61000-4-2 level 4 Rev. 01 -- 5 February 2010 Product data sheet 1. Product profile 1.1 General description The IP4350CX24 is a diode array designed to provide protection to downstream components against ElectroStatic Discharge (ESD) voltages as high as 15 kV. The IP4350CX24 integrates 9 pairs of rail-to-rail diodes, 12 Zener diodes and 15 resistors in a single wafer-level chip-scale package. It is fabricated using monolithic silicon semiconductor technology and measures only 1.95 mm x 2.11 mm. These features make the IP4350CX24 ideal for use in applications requiring a high degree of miniaturization, such as mobile phone handsets, cordless telephones and personal digital devices. 1.2 Features I I I I I I I I I I Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) All SD memory card channels with integrated ESD protection, EMI and RF filters ESD protection up to 15 kV on 9 channels at output terminals Integrated EMI and RF filters with pull-up resistors on 5 channels Integrated EMI and RF filters on 4 channels Additional SD card power supply protection Wafer level chip-scale package with 0.4 mm pitch Write protection, card detect biasing resistor integrated Supports electrical card detection Also available as IP4352CX24 with different filter behavior, same footprint 1.3 Applications I I I I I SD memory card interfaces in cellular and PCS mobile handsets Cordless telephones Digital still and video cameras Media players Card readers NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 2. Pinning information 2.1 Pinning bump A1 index area 1 2 IP4350CX24 3 4 5 A B C D E 001aaj749 Transparent top view Fig 1. Pin configuration IP4350CX24 2.2 Pin description Table 1. Symbol DATA2 DATA3 GND_H SDDATA2 SDDATA3 CD CMD SDCD SDCMD DAT3_PD WP DAT3_PU SDWP VSD WP+CD CLK GND_C SDWP+CD SDCLK IP4350CX24_1 Pin description Pin A1 A2 A3 A4 A5 B1 B2 B4 B5 C1 C2 C3 C4 C5 D1 D2 D3 D4 D5 Type[1] I/O I/O S I/O I/O O I/O I I/O I O I O S I/O I/O S I/O I/O Description data 2 input or output data 3 input or output supply ground on host side data 2 input or output on SD card side data 3 input or output on SD card side card detect output command input or output on host side card detect intput command input or output on SD card side data 3 pull-down write protect data 3 pull-up write protect on SD card side memory card supply voltage write protect and card detect clock signal input or output card supply ground write protect and card detect on SD card side clock signal on SD card side (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 2 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter Pin description ...continued Pin E1 E2 E3 E4 E5 Type[1] I/O I/O S I/O I/O Description data 1 input or output data 0 input or output card supply ground data 1 input or output on SD card side data 0 input or output on SD card side Table 1. Symbol DATA1 DATA0 GND_C SDDATA1 SDDATA0 [1] I = input, O = output, I/O = input and output, S = power supply. 3. Ordering information Table 2. Ordering information Package Name IP4350CX24 WLCSP24 Description wafer level chip-size package; 24 bumps; 1.95 x 2.11 x 0.61 mm Version IP4350CX24/LF Type number 4. Functional diagram VSD DAT3_PU R11 R12 R13 R14 R15 R1 CLK R2 SDCLK SDCMD R3 CMD DATA0 R4 SDDATA0 SDDATA1 R5 DATA1 DATA2 R6 SDDATA2 SDDATA3 R7 DATA3 CD R8 SDCD SDWP R9 WP WP+CD R21 SDWP+CD DAT3_PD GND_H GND_C 001aaj750 Fig 2. Schematic diagram IP4350CX24 IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 3 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 5. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI VESD Parameter input voltage electrostatic discharge voltage IEC 61000-4-2, level 4; output pins A4, A5, B4, B5, C4, C5, D4, D5, E4, E5 with pins A3, D3, E3 as ground contact discharge air discharge IEC 61000-4-2, level 1, all other pins with A3, D3, E3 as ground contact discharge air discharge Pch Ptot Tstg Treflow(peak) Tamb [1] [1] Conditions Min -0.5 Max +5.0 Unit V -8 -15 +8 +15 kV kV -2 -2 -55 -30 +2 +2 25 100 +150 260 +85 kV kV mW mW C C C channel power dissipation total power dissipation storage temperature peak reflow temperature ambient temperature continuous power; Tamb = 70 C Tamb = 70 C 10 s maximum Device is qualified with 1000 pulses of 15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). 6. Characteristics Table 4. Characteristics Tamb = 25 C unless otherwise specified. Symbol Rs(ch) Parameter channel series resistance Conditions R1 to R9 R11 to R14 R15 R21 Cch channel capacitance including diode capacitance; VI = 0 V; f = 1 MHz each data channel from SD card to I/O interface CLK channel DAT3_PD DAT3_PU VSD VBR ILR [1] [1] Min 12 35 3.29 329 Typ 15 50 4.7 47 Max 18 65 6.11 611 Unit k k k 6 - 8.8 7.8 6 5 37 - 100 pF pF pF pF pF V nA breakdown voltage reverse leakage current Guaranteed by design. II = 1 mA VI = 3 V IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 4 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 7. Frequency response Table 5. Symbol il Frequency response Parameter insertion loss Conditions all channels; Rsource = 50 ; RL = 50 f < 400 MHz 400 MHz < f < 800 MHz 800 MHz < f < 2.5 GHz 2.5 GHz < f < 6.0 GHz Table 6. Symbol tr tf Time domain response[1] Parameter ns[2] load 20 pF || 100 k load 40 pF || 100 k fall time load 20 pF || 100 k load 40 pF || 100 k [1] [2] All rise or fall times measured using source with 0 V to 3 V steps, 10 % to 90 %. Performed on all high speed lines (channels including R1 to R9, see Figure 2). Min Typ Max Unit 3 6 15 - 3 6 15 25 dB dB dB dB Conditions Min - Typ 2.3 3.4 2.4 3.5 Max - Unit ns ns ns ns high speed Rsource = 50 ; tr = tf = 2 rise time 8. Application information 8.1 Insertion loss The insertion loss measurement configuration of a typical NetWork Analyzer (NWA) system is shown in Figure 3. The insertion loss is measured with a test PCB utilizing laser drilled micro-via holes that connect the PCB ground plane to the IP4350CX24 ground pins. DUT IN 50 OUT TEST BOARD 50 Vgen 001aai718 Fig 3. Frequency response set-up The frequency response curves for all channels at frequencies up to 6 GHz are shown in Figure 4 to Figure 7. IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 5 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 0 s21 (dB) -10 001aaj751 (2) -20 (1) -30 -40 10-1 1 10 102 103 f (MHz) 104 (1) pin A1 to pin A4 (2) pin A2 to pin A5 Fig 4. Measured insertion loss magnitudes 0 s21 (dB) -10 (2) 001aaj752 (1) -20 (3) -30 -40 10-1 1 10 102 103 f (MHz) 104 (1) pin B1 to pin B4 (2) pin B2 to pin B5 (3) pin C2 to pin C5 Fig 5. Measured insertion loss magnitudes IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 6 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 0 s21 (dB) -10 (1) (2) 001aak050 -20 -30 -40 10-1 1 10 102 103 f (MHz) 104 (1) pin D1 to pin D4 (2) pin D2 to pin D5 Fig 6. Measured insertion loss magnitudes 0 s21 (dB) -10 001aak051 (2) -20 -30 (1) -40 10-1 1 10 102 103 f (MHz) 104 (1) pin E1 to pin E4 (2) pin E2 to pin E5 Fig 7. Measured insertion loss magnitudes 8.2 Crosstalk The set-up for crosstalk measurements in a 50 NWA system from one channel to another is shown in Figure 8. Typical examples of crosstalk measurement results are depicted in Figure 9, Figure 10 and Figure 11. Unused channels are terminated with 50 to ground. IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 7 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter IN_1 50 DUT OUT_2 OUT_1 50 50 IN_2 50 TEST BOARD Vgen 001aag220 Fig 8. Crosstalk measurement configuration -20 ct (dB) -40 (1) 001aaj797 (2) -60 -80 -100 10-1 1 10 102 103 f (MHz) 104 (1) pin A1 to pin B4 (2) pin A1 to pin E4 Fig 9. Crosstalk behavior between adjacent channels IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 8 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter -20 ct (dB) -40 (1) (2) 001aaj795 -60 -80 -100 10-1 1 10 102 103 f (MHz) 104 (1) pin A2 to pin E5 (2) pin A2 to pin B5 Fig 10. Crosstalk behavior between adjacent channels -20 ct (dB) -40 (2) 001aaj796 -60 (1) -80 -100 10-1 1 10 102 103 f (MHz) 104 (1) pin C2 to pin E5 (2) pin C2 to pin D5 Fig 11. Crosstalk behavior between adjacent channels IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 9 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 9. Package outline WLCSP24: wafer level chip-size package; 24 bumps; 1.95 x 2.11 x 0.61 mm IP4350CX24 D B A bump A1 index area A2 E A A1 detail X e1 e b E e D e2 C B A 1 2 3 4 5 X 0 Dimensions Unit mm A A1 A2 b D E e 0.4 e1 1.6 e2 1.6 1 scale 2 mm max 0.66 0.22 0.31 2.00 2.16 nom 0.61 0.20 0.41 0.26 1.95 2.11 min 0.56 0.18 0.21 1.90 2.06 IP4350CX24_lf_po Outline version IP4350CX24 References IEC JEDEC JEITA European projection Issue date 09-04-06 09-07-15 Fig 12. Package outline IP4350CX24/LF (WLCSP24) IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 10 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 10. Soldering of WLCSP packages 10.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this package. All NXP WLCSP packages are lead-free. 10.2 Board mounting Board mounting of a WLCSP requires several steps: 1. Solder paste printing on the PCB 2. Component placement with a pick and place machine 3. The reflow soldering itself 10.3 Reflow soldering Key characteristics in reflow soldering are: * Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 13) than a PbSn process, thus reducing the process window * Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board * Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 7. Table 7. Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 Package thickness (mm) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 13. IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 11 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering description". 10.3.1 Stand off The stand off between the substrate and the chip is determined by: * The amount of printed solder on the substrate * The size of the solder land on the substrate * The bump height on the chip The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip. 10.3.2 Quality of solder joint A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to be related to these voids. Solder joint inspection after reflow can be done with X-ray to monitor defects such as bridging, open circuits and voids. 10.3.3 Rework In general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from the substrate, most solder balls of the chip will be damaged. In that case it is recommended not to re-use the chip again. IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 12 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. The surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill removed. When a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the substrate. Place and align the new chip while viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering description". 10.3.4 Cleaning Cleaning can be done after reflow soldering. 11. Abbreviations Table 8. Acronym DUT EMI ESD NWA PCB PCS RFI RoHS SD Abbreviations Description Device Under Test ElectroMagnetic Interference ElectroStatic Discharge NetWork Analyzer Printed-Circuit Board Personal Communication System Radio Frequency Interference Restriction of Hazardous Substances Secure Digital 12. Revision history Table 9. Revision history Release date 20100205 Data sheet status Product data sheet Change notice Supersedes Document ID IP4350CX24_1 IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 13 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products -- Unless the data sheet of an NXP Semiconductors product expressly states that the product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the (c) NXP B.V. 2010. All rights reserved. 13.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or IP4350CX24_1 Product data sheet Rev. 01 -- 5 February 2010 14 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP4350CX24_1 (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 -- 5 February 2010 15 of 16 NXP Semiconductors IP4350CX24 9-channel SD memory card interface ESD protection filter 15. Contents 1 1.1 1.2 1.3 2 2.1 2.2 3 4 5 6 7 8 8.1 8.2 9 10 10.1 10.2 10.3 10.3.1 10.3.2 10.3.3 10.3.4 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Frequency response . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 5 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering of WLCSP packages. . . . . . . . . . . . 11 Introduction to soldering WLCSP packages . . 11 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 11 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 11 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Quality of solder joint . . . . . . . . . . . . . . . . . . . 12 Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 February 2010 Document identifier: IP4350CX24_1 |
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